
Copper heat-transfer and anodized aluminum parts for AI-server cooling — machined to 0.005 mm-class sealing flatness.

Simultaneous 5-axis, one-setup machining holding 0.002 mm profile tolerance on the harmonic-drive interface.

Transparent polycarbonate device body molded in the Class 10,000 cleanroom under ISO 13485.

Fluoropolymer fluid components for semiconductor media handling, cleanroom-cleaned and double-bagged.

Thin-wall AZ91D structural casting, CNC-finished datums and threads, ready to assemble.

Bar-fed turn-mill production with ≤0.005 mm runout verified on concentricity gauges.

Both run on the same machine — but they are different processes with different costs. A practical guide to choosing.
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Process capability is not inspection — it is machine grouping, thermal discipline, and gauging every cycle. Inside our volume lines.
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Cold plates trade thermal conductivity against machinability, weight and cost. What we have learned producing them at volume.
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